News
Technological parameters upgrade

NEWS

15/06/2016

Technological parameters upgrade

Dear customers!

Owing to completed upgrade of our production lines in 2015-2016 we have achieved higher technological standards in PCB production and enhanced the quality of our products. This allowed us to improve the technological level of standard orders made without additional charge for complexity. Below is the list of main technological parameters which are improved for standard orders:

Minimum conductor / gap in all layers - 0,125/0,125 mm (0,15/0,15 mm before)
Minimum via rim – 0,15 mm (0,2 mm before)
Minimum mounting hole rim – 0,20 mm (0,25 mm before)
Ration of minimum hole diameter to the thickness of PCB – 1:7 (1:5 before)
Distance between copper and hole in inner layer – 0,35 mm (0,4 mm before)
Minimum soldermask bridge – 150 mkm with spacing to copper 50 mkm (75 mkm before)

Please find below basic technological abilities for complicated PCBs with additional charge for complexity =1,5

Minimum conductor / gap in all layers – 0,10/0,10 mm
Minimum hole diameter – 0,20 mm
Minimum via rim – 0,10 mm
Minimum mounting hole rim – 0,15 mm (0,20 mm before)
Ration of minimum hole diameter to the thickness of PCB – 1:10 (1:7 before)
Distance between copper and hole in inner layer – 0,25 mm (0,35 mm before)
Ration of depth of drilling to the diameter of PTH hole – 0,7 (new!)
Minimum soldermask bridge – 100 mkm (150 mkm before) with spacing to copper 25 mkm (50 mkm before)

Applied equipment and technologies allow us to produce PCBs with even higher technological parameters than mentioned above, but due to complexity the cost of such orders is calculated individually. If your project matches neither standard requirements nor order with charge for complexity 1,5 – do not hesitate to contact us and send your query including file of PCB and its description to our e-mail pcb@rezonit.ru, we will reply promptly.