PCB production news

Dear customers!

We continuously improve the quality and manufacturability of our products. During the transition to new multilayer PCB stackup, we tried to take into account modern requirements for printed circuit boards to make it easier for designers to design high-speed lines, including those with controlled impedance. We also unified the thickness of the external dielectric for all stackups.

At the moment, the changes have affected the 4-layer stackups with a foil thickness of 18 microns.
Description of new stackups can be found in our PCB reference.