PCB holes protection
For the realization of a wide range of PCB design ideas we offer new services of urgent production on our production site Zubovo (Moscow region).
The technology of PCB through-holes tenting with a dry solder mask is performed by applying an additional thin layer on the contact pads of the holes through-holes before applying a liquid solder mask. Tenting ensures the insulation of the through-holes and eliminates possible closures during PCB assembly, as well as protects the metallization of the walls of the through-holes from environmental exposure. This technology complies with IPC 4761 Type II b. At the moment the following options are available for express order: the minimum \ maximum diameter of the hole-0.1 mm \ 1.2 mm .
Increasingly, developers are faced with the need to place the through-holes directly on the components pads, which can cause a lot of problems during subsequent PCB assembly: for example, the leakage of solder through the through-hole. In this case, the holes must be filled with a special compound and tented with an additional layer of copper. Our production offers service of filling the through-hole with an epoxy non-conductive compound with the subsequent tenting by a layer of galvanic copper that corresponds to the IPC 4761 Type VII standard. At the moment the following options are available for express order: the minimum \ maximum diameter of the hole is 0.1 mm \ 0.8 mm, the minimum thickness of the PCB is 0.5 mm.
For answers to the frequently asked questions on these technologies, go to the link.
To order these options, specify your wish in the "additional requirements for the project" column. Our engineers are ready to advise on technological possibilities of production of printed circuit boards on multichannel phones: 8 495 777 8080 and 8 800 700 8118.